Welcome Guest | |
Submit Your Sourcing Requirement
Advanced Search Filtersdown arrow
Print

Kohesi Bond

Company Summary:

  • Since 2015
  • 1-5 Employees
  • Turnover 5,00,000.00 USD per year
  • Partnership

Additional Contacts:

http://www.kohesibond.com
Export Department
Utsav Shah
Phone: +91 - 22 - 25669144/+91 - 9819357209
Fax: +91 - 22 - 25669145

Company Address:

209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S Marg, Bhandup West
Mumbai
India, 400078
Web Page Link: https://www.toboc.com/kohesibond.aspx

Products

Listing 1 to 25 of 50 result(s)
Display Per Page: 

KB 1427 HT   

Kohesi Bond KB 1427 HT is a marvelous single component epoxy system for bonding, coating, sealing and casting applications. Although it requires a minimum temperature of 150& 176C for curing, it can achieve faster cures at elevated temperatures. KB 1427 HT offers an extremely wide serviceable temper

More...

KB 1427 HT-3   

Kohesi Bond KB 1427 HT-3 is an exclusive one component epoxy system that can cure completely in 2 – 3 minutes at 150& 176C. Although it requires a minimum temperature of 120& 176C for curing, it cures equally fast (3 – 5 minutes) at that temperature. KB 1427 HT-3 offers an extremely wide serviceable

More...

KB 1613 HT   

Kohesi Bond KB 1613 HT is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120& 176C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 HT

More...

KB 1613 R80   

Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature. Unlike other one component epoxies, this product ca

More...

KB 1613 RLV   

Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120& 176C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 R

More...

TUF 1613 HT-CM   

Kohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120& 176C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.

More...

TUF 1613 HT-DA   

Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only needs elementary refrigeration for storage and offers an unlimited working life at room temperatur

More...

TUF 1613 HT-GT   

Kohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120& 176C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated tempe

More...

TUF 1613 HT-SM   

Kohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120& 176C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures. TUF 1613

More...

TUF 1820 ANHT   

Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 90 minutes at 1

More...

TUF 1820 AOHT   

Kohesi Bond TUF 1820 AOHT is a noteworthy toughened, single component epoxy system that requires no mixing and offers an unlimited working life at room temperature. It cures in merely 60 – 70 minutes at 120& 176C and even faster at higher temperatures. TUF 1820 AOHT offers a sweeping serviceable tem

More...

TUF 1820HTS   

Kohesi Bond TUF 1820 HTS is a toughened, single component, silver conductive epoxy system that requires no mixing and offers an unlimited working life at room temperature. Firstly, this product offers phenomenal electrical as well as thermal conductivity. It cures in merely 60 – 80 minutes at 120& 1

More...

TUF 1828 TC   

Kohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin

More...

KB 1031 AT-2LO   

Kohesi Bond KB 1031 AT-2LO is a two component, highly flexibilized epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:3 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test

More...

KB 1031 AT-S   

Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.

More...

KB 1031 ATFL-N   

Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength. This epoxy sys

More...

KB 1031 ATHT-LO   

Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test. The op

More...

KB 1031 SPLV-6   

Kohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This high performance specialty product offers a unique combination of low viscosity, low exotherm and very long working

More...

KB 1039 CRLP   

Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, com

More...

KB 1039 CRLP-AO   

Kohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals,

More...

KB 1040   

Kohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, c

More...

KB 1040 AN-1   

Kohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing t

More...

KB 1040 AOHT   

Kohesi Bond KB 1040 AOHT is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of t

More...

KB 1040 CTE-LO   

Kohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of pass

More...

KB 1040 P   

Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among

More...

Listing 1 to 25 of 50 result(s)
Display Per Page: 

GET A QUOTE

>