Kohesi Bond

TUF 1613 HT-DA

Kohesi Bond TUF 1613 HT-DA is a fast curing, true single component epoxy system for die attach applications. Unlike other die attach systems, TUF 1613 HT-DA is not a premixed and frozen system. It only needs elementary refrigeration for storage and offers an unlimited working life at room temperature. It cures exceptionally fast in 5 – 10 minutes at 150& 176C. TUF 1613 HT-DA dispenses ideally leaving no tail behind and can be easily used with automated dispensing equipment. It offers an extensive serviceable temperature range of -70& 176C to +200& 176C. It adheres well to a broad variety of substrates including metals, ceramics, most plastics and glass. It provides outstanding die shear strength and is capable of passing NASA low outgassing test specifications. TUF 1613 HT-DA offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K. It has the capability to withstand ard-uous thermal cycling. In addition to superior electrical insulation, TUF 1613 HT-DA also offers less than 1 Percent weight change after rigorous 168 hours of 85& 176C/85 Percent RH test. It has a standard light yellow – tan color. This perfect combination of remarkable performance, ease of use, incomparable die shear strength and dimensional stability makes TUF 1613 HT-DA a guru for die attach applications.PRODUCT HIGHLIGHTS Remarkable die shear strength Ultimate dispensing profile Thermally conductive Low ionic content (chlorine < 15 ppm) Capable of passing NASA low outgassing Unlimited working life at room temperatureTYPICAL APPLICATIONS Die Attach Bonding SealingIndustrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)Packaging : Cans, Pails, Syringes

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