Kohesi Bond

KB 1613 RLV

Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120& 176C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures. KB 1613 RLV offers an extensive serviceable temperature range of -50& 176C to +180& 176C. This product’s exquisite flow properties makes it ideal for use in underfill, potting and encapsulation applications. Being a one component system, it provides ease of application and also adheres well to an encyclopedic variety of substrates including metals, ceramics, most plastics and glass. It provides sterling mechanical strength properties and dimensional stability. KB 1613 RLV offers phenomenal thermal conductivity of 1 – 1.2 W/m/K. In addition to superior electrical insulation, KB 1613 RLV also offers astounding chemical resistance to a variety of fuels, oils and water. It has a light yellow color, but it can be color matched to your specifications upon request. With a unique combination of remarkable performance, ease of use and excellent mechanical strength properties, KB 1613 RLV is widely used in electronics and microelectronics packaging and assembly applications.PRODUCT HIGHLIGHTS Thermally conductive Castable up to 1 inch thicknesses Rapid cures at elevated temperatures Superior dimensional stability Exceptional electrical isolator Unlimited working life at room temperatureTYPICAL APPLICATIONS Underfill Potting Encapsulation Sealing CoatingIndustrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595)Packaging : Cans, Pails, Syringes

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