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Xinxunwei Technology

Company Summary:

  • Since 2010
  • 51-75 Employees
  • Turnover 1,000,000.00 USD per year
  • Limited Company

Additional Contacts:

www.xw360.com
Export Department
Cindy Cao
Phone: +86 - 0755 - 61506419/+86 -
Fax: +86 -

Company Address:

3 Floor,No.2 Workshop,Xintang Industrial Park,Baishixia,Fuyong Street,Baoan District,Shenzhen
shenzhen, Guangdong
China, 518103
Web Page Link: http://www.toboc.com/xinxunweitechnology

Products

Listing 1 to 11 of 11 result(s)
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CHINAFIX CF350 with new design BGA rework station   

Solder Type:Leaded Solder /Lead FreeSMD Type:Micro bga,BGA,CSP,QFPPCB Thickness:0.5mm~4mmPCB Size:W50mm*D50mm~W455mm*D350mmHeating Mode /Power(Upper):Hot-blast air /800WHeating Mode /Power(Bottom):Hot-blast air /800WPreheating Mode/Power:IR / 2400WPCB Location Mode:Shape or TongsDriving Mode:Gear,Ra

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minitype CHINAFIX CF320 BGA rework station/sold...  

Solder Type:Leaded Solder/Lead FreeSMD Type:Micro BGA,BGA,CSP,QFPPCB Thickness:0.5mm~4mmPCB Size:80mm*80mm 415mm*325mm Heating Mode/Power(upper):Hot-blast air /650WHeating Mode/Power(bottom):Hot-blast air /650WPreheating Mode/Power:IR / 1000WPCB Location Mode:Shape or TongsDriving Mode:Gear,Rack Co

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HOT SELLING!!! CHINAFIX CF350T threes heating z...  

Solder Type:Leaded Solder/Lead freeSMD Type:Micro bga,BGA,CSP,QFPPCB Thickness:0.5mm~4mmPCB Size:W50mm*D50mm~W455mm*D350mmHeating Mode/Power(Upper):Hot-blast air /800WHeating Mode/Power(Bottom):Hot-blast air /800WPreheating Mode/Power:IR /2400wPCB Location Mode:Shape or TongsDriving Mode:Gear,rackCo

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FEATURED PRODUCT CHINAFIX CF360T touch-screen b...  

Solder Type:Lead/Lead freeSMD Type:Micro bga,BGA,CSP,QFPPCB Thickness:0.5mm~4mmPCB Size:W50*D50~W455*D350mmHeating Mode/Power(Upper):Hot-blast air /800WHeating Mode/Power(Bottom):Hot-blast air /800WPreheating Mode/Power:IR 2400WPCB Location Mode:Shape or TongsDrive Mode:Gear,RackControl/Adjusting Mo

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Upgraded CHINAFIX CF260 110V/220V instrument-co...  

Solder Type:Lead Solder/Lead FreeSMD TypeMicro BGA,BGA,CSP,QFP:PCB Thickness0.5mm~4mmPCB Size:W50*D50mm~W440*D310mmHeating Mode/Power(Upper):Hot-blast air / 800WHeating Mode/Power(Bottom):Hot-blast air / 800WPreheating Mode/Power:IR / 2200WPCB Location Mode:Shape or TongsDrive Mode:Gear,RackControl

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HOT SALE CHINAFIX CF160 infrared BGA soldering ...  

Power supply:AC 220V/50-60HZHeating Meth`od:Two-side infrared heatingDemension:Lmm360*Wmm520*H430mmMaximum Power:2.3KWPCB size:405mm*310mmHeating controlled independently:YesUpper heating control meth`od:High-precision closed-loop control, instrument error is about 0.5 PercentUpper temperature contr

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HOT SELLING CHINAFIX CF300T laptop Mini BGA rew...  

Solder Type:Leaded Solder/Lead FreeSuitable SMD Type:Micro bga,BGA,CSP,QFPPCB Thickness:0.5mm~4mmPCB Size:415mm*325mm --- 80mm*80mmHeating Mode/Power(Upper):Hot-blast air /650WHeating Mode/Power(Bottom):Hot-blast air /650WPreheating Mode/Power:IR / 700wPCB Location Mode:Shape or TongsDriving Mode:Dr

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NEW PRODUCT CHINAFIX CF300 Mini IR BGA rework m...  

Solder Type:Leaded Solder/Lead FreeSMD type:Micro BGA,BGA,CSP,QFPPCB Thickness:0.5mm~4mmPCB Size:80mm*80mm 415mm*325mm Heating Mode /Power (Upper):Hot-blast air /650WHeating Mode/Power(Bottom):Hot-blast air /650WPreheating Mode/ Power:IR/ 700WPCB Location Mode:Shape or TongsDriving Mode:Driving By

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high cost performance CHINAFIX CF360 intelligen...  

Solder Type:Leaded Solder / Lead FreeSMD Type:Micro bga,BGA,CSP,QFPPCB Thickness:0.5mm~4mmPCB Size:W50mm*D50mm~W455*D350mmHeating Mode/Power (Upper):Hot-blast air /800WHeating Mode/Power (Bottom):Hot-blast air /800WPreheating Mode/Power:IR / 2400WPCB Location Mode:Shape or TongsDrive Mode:Gear,RackC

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The newest design CHINAFIX CF6810 optical align...  

Solder Type:Leaded Solder/Lead freeSMD Type:Micro BGA,BGA,CSP,QFPPCB Thickness:0.5mm---4mmPCB Size:W50*D50---W420*D400mmUpper Heating Mode/Power:Hot blast air/800WBottom Heating Mode/Powder:Hot blast air/800WPreheating Mode/Power:IR/2400WPCB Location Mode:Shape or TongsDrive Mode:Gear, Rack, Precisi

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high cost peroformance touch-screen CHINAFIX CF...  

Solder Type:Leaded/Lead FreeSMD Type:Micro BGA,BGA,CSP,QFPPCB Thickness:0.5~4mmPCB Size:W50*D50~W440*D310mmHeating Mode/Power(Upper):Hot-blast air /800WHeating Mode/Power(Bottom):Hot-blast air /800WPreheating Mode/Power:IR /2200WPCB Location Mode:Shape or TongsDriver Mode:Gear,RackControl/Adjusting

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Listing 1 to 11 of 11 result(s)
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