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4/F, Block C, Liyue industrial park, Fenghuan,Fuyong ,Bao'an ,Shenzhen, Guangdong,Chinashenzhen, guangdongChina, 518110Web Page Link: http://www.toboc.com/shenzhensunsomautomaticequipmentcoltdD&B D-U-N-S Number: 123456780
1. About the application field of FOG/FOB bonding equipment XCM71 - A5 FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panels production and maintenance such as: television (TV), laptop computers (NOTE BOOK), liquid crystal` display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises. 2.About the basic parameters of FOG/FOB bonding equipment XCM71 -A5Input Power: AC220V 50-60Hz Working pressure :0.4-0 .8 Mpa Operating modes: 7-inch HMI Dimensions: L2210 × W1730 × H1500 mm The meth`od of Heating: heating or pulse heating thermostat The quantity of Fixture: 2 group X-Y-? micrometer adjustable Range of Temperature : RT-500 Control program: PLC controller Body main material: Steel + baking varnishThe thermocouple: K type3.About the functions and characteristics of the FOG/FOB bonding equipment XCM71 - A5 3.1use pneumatic components of Japan SMC and high-precision the moving parts 3.2 use temperature controller of Japan and The function module of the integral PID self-tuning temperature,accurate temperature.3.3 Imported PLC control:the operation of 7-inch full-color touch-screen 3.4SUNSOM the elimination structure of double-cylinder deadweight, accurate pressure.
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Shenzhen Sunsom automatic equipment Co.,Ltd .