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Leixinda Electronics(Shenzhen)Co.,Ltd.

Company Summary:

  • Since 2005
  • 301-400 Employees
  • Turnover 15,000,000.00 USD per year
  • 90% turn over from existing products
  • 90 year(s) of Export Experience
  • Limited Company

Additional Contacts:

http://www.leixinda.com
Export Department
Carrie Shi
Phone: +86 - 0755 - 23090047/+86 - 13423725064
Fax: +86 - 0755 - 23090047

Company Address:

Block 12, Fuhua Industrial Estate, Tangwei village, Fuyong Town, Bao'An District, Shenzhen City,Guangdong province, China
Shenzehn, Guangdong
China, 518103
Web Page Link: http://www.toboc.com/leixindaelectronicsshenzhencoltd

Products

Listing 1 to 10 of 10 result(s)
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pcb   

Production type: AutomoileMaterial:FR-4,0.6mmLayout count:3Finishing: Lead Free HASLMin hole size: 0.3mmBlind Vias: YesBuried Vias: N/AMin Track W/S:0.3/0.3Remarks: 2oz copper weight

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electronic component   

Lay: 6LMaterial:FR-4Board thickness: 1.6mmCopper thinckness: 1/1 1/1Circuit/space: 8/8Surface: immersion goldSpecial: Tg170, 6array BGA

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Printed circuit board   

Production type: industry controlMaterial:FR-4,0.6mmLayout count:6Finishing: Fb Free HASLMin hole size: 0.2mmBlind Vias: N/ABuried Vias: N/AMin Track W/S:0.1/0.1mmRemarks: impedance control

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electronic PCB   

Lay: 2LMaterial:FR-4Board thickness: 1.6mmCopper thinckness: 1/1Circuit/space: 5/5Surface: immersion tinSpecial Process: Special white

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PCB for Assembly   

Production type: CommunicationBoard thickness: 1.0mmSurface: immersion goldMin hole size: 0.2mmBlind Vias: N/ABuried Vias: N/AMin Track W/S:0.1/0.075mmRemarks: Bluetooth model, Semi holes

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PCB With finger god 40”   

Lay: 6LMaterial:FR-4Board thickness: 1.6mmCopper thinckness: 1oz all layerCircuit/space: 5/4Surface: ENIGSpecial: With finger god 40”

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PCBA pcb board   

Production type: industry controlMaterial: FR-4, 1.6mm, HTGLayer count: 6Finishing: immersion goldMin hole size: 0.25mmBlind Vias: N/ABuried Vias: N/AMin track w/s: 0.1/0.1mmRemarks: N/A

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PCB manufacture   

Production type: CommunicationMaterial: FR-4, HTC, LOW DK, 3.2mmLayer count: 6Surface: immersion tinMin hole size: 0.1mmBlind Vias: N/ABuried Vias: N/AMin Track W/S:0.15/0.15mmRemarks: Press Hit holes

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Mixed Impedance Cntrol 8L PCB   

Production type: Industry ControlMaterial: FR-4, 1.6mmLayer count: 8Surface: Pb Free HASLMin hole size: 0.2mmBlind Vias: N/ABuried Vias: N/AMin Track W/S: 0.1/0.1mmRemarks: Mixed Impedance Control

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HTG PCB   

Layer: 6LMaterial: FR-4, 1.6mmCopper thickness: 1/1 1/1Circuit/space: 8/8Surface: immersion goldSpecial: Tg170

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Listing 1 to 10 of 10 result(s)
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